Fraunhofer CSP and HTWK Leipzig Develop New Test Method for Photovoltaic Wafers

The standardized process facilitates quality control in the solar industry

© Foto Fraunhofer CSP/Cornelia Dietze

Stephan Schönfelder (left) from the HTWK Leipzig and Felix Kaule from the Fraunhofer CSP observing a 4-point bending test with a polycrystalline silicon wafer/ © Foto Fraunhofer CSP/Cornelia Dietze