Hitachi High-Technologies Europe GmbH

Theodor-Heuss-Anlage 12, 68165 Mannheim
Germany
Telephone +49 621 41002-0
Fax +49 621 41002-41

Hall map

Energy Storage Europe 2018 hall map (Hall 8b): stand F13

Fairground map

Energy Storage Europe 2018 fairground map: Hall 8b

Our range of products

Product categories

  • 07  Production Technologies
  • 07.01  Battery Production Technologies

Our products

Product category: Battery Production Technologies

Conductor Etch System 9000 Series

Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series to support these next-generation processes.

Feautures:

The new HHT 9000 platform utilizes Hitachi’s proprietary low-contaminant, high-speed transfer system for high productivity.
The linked common platform permits process flexibility and future expansion through its modular chamber design.
Platform and user interface standardization will facilitate a smooth transition to 450-mm wafer sizes.
The 9000 platform incorporates HHT’s new microwave ECR(Electron Cyclotron Resonance) plasma etching chamber that is proven in high volume manufacturing usage.

Specification:
Applicable wafer diameter: 300mm
System configuration: 9 chambers (max.)

More Less

Product category: Battery Production Technologies

Conductor Etch System M-8000 Series

Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond.
Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal gate through JDP (Joint Development Program) with device makers and material / tool suppliers.
Hitachi High-Tech's etch system provides superior profile controllability and CD uniformity within wafer with a new microwave ECR (Electron Cyclotron Resonance) plasma etching chamber, high speed wafer temperature control, and high vacuum exhaust control technology.
Hitachi High-Tech's AEC (Advanced Equipment Control) / APC (Advanced Process Control) technology with original data collection, analysis and control systems provide excellent productivity and reliability.

Specification:
Applicable wafer diameter: 300mm
System configuration: 4 chambers (max.)

More Less

Product category: Battery Production Technologies

Conductor Etch System M-600/6000 Series

Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc.
Low temperature etch technology and TM (Time Modulation) bias technology together with the ECR (Electron Cyclotron Resonance) high density plasma source provide for a clean process, superior trench profiles without sidewall residue, and excellent productivity.


Specification:
Applicable wafer diameter: 150mm, 200mm
System configuration: 2 etch+ 2 ash (max.)

More Less

About us

Company details

A trading company with an emphasis on creativity and leading-edge technology, Hitachi High-Technologies Co., Ltd. Japan is a member of the Hitachi Group. Hitachi High-Technologies in Europe handles a wide variety of products - from computers and peripherals to scientific instruments and systems, electronic devices, and industrial machinery and materials.

More Less